KURZ INDIA to showcase advanced hot stamping, cold transfer and digital finishing solutions at LabelExpo 2024.
KURZ INDIA is set to showcase the next generation of embellishment technologies at the upcoming Labelexpo India 2024 at its Booth G10 in Hall 10 of the show. Visitors will witness a range of advanced solutions in hot stamping, cold transfer, and digital finishing from the “One Step Solution” provider company.
KURZ INDIA’s Labelexpo India 2024 highlights include cold-transfer metallization, vibrant colour effects, and haptic enhancements for industries like labels, covers, beverages cosmetics and security.
The new KPW slim solution, with a thin 6 µm carrier, leads material-saving efforts, emphasizing the brand’s eco-conscious approach.
Notable innovations include the DISTORUN 2.0 module, enabling optimal use of transfer carriers, and TRUSTSEAL SFX technology for creating eye-catching 3D effects.
On the security front, KURZ India will present counterfeit-proof labels pattern, ensuring product safety with unique security features.
Visual demonstrations of the DM-UNILINER 2D and 3D machines on screen will showcase the latest digital finishing capabilities, offering flexibility for pre- and post-print processes.
KURZ INDIA’s focus on sustainability shines through its reduced CO2 footprint, with thinner transfer products and minimized material consumption. The company’s innovations underline its strong position as a one-stop solution provider for embellishment and security needs.
Visitors will experience KURZ INDIA’s latest range of technologies firsthand at Labelexpo 2024 from November 14 to 17.
